✅ The Challenge
A leading South Korean printed circuit board (PCB) manufacturer was encountering challenges in their acid tin electroplating line, specifically:
- Pinholes and uneven plating on fine-line circuit patterns
- Tin bath instability and poor throwing power on complex vias
- Contamination and metal precipitation in older stannous sulfate baths
- Environmental pressure to eliminate sulfate-based plating solutions
They were looking for a cleaner, more stable tin source with excellent conductivity and compatibility with modern PCB production lines.
🧪 The Solution
HoriazonChemical supplied high-purity Tin(II) Methanesulfonate, optimized for acid tin plating:
- Tin content: ~200 g/L, with low Fe, Cu, Pb, and SO₄ impurities
- Clear, stable aqueous solution, easy to replenish and maintain
- Free from sulfate, nitrate, and halide ions – ideal for microelectronics
- Delivered in 250 kg PE drums, corrosion-resistant packaging
- Full documentation with each shipment
- Technical guidance for bath formulation, pH control, and anode ratio optimization
📈 The Results
✔️ Improved Surface Uniformity
Plating became smoother and more uniform across complex PCB geometries.
✔️ Fewer Defects
Significant reduction in micro-voids, pinholes, and rough plating.
✔️ Longer Bath Life
Bath maintenance intervals doubled; no sludge formation after 2 months.
✔️ Higher Yield
Reduction in rework and rejection rate by over 15%.
💬 Client Testimonial
“HoriazonChemical’s Tin Methanesulfonate completely stabilized our acid tin process. It’s cleaner, simpler, and delivers better plating results every time.”
— Process Engineer, Top-5 PCB Producer (South Korea)
🧲 Precision Chemistry for PCB Performance
HoriazonChemical’s Tin(II) Methanesulfonate offers a modern plating solution for demanding PCB production—delivering cleaner baths, smoother finishes, and higher line efficiency. Contact us for quotes, product information, sample requests, or technical support. Our team will respond within 24 hours.